Bacterial Imager Proposed

Petapixel, Phys.org: University of Exeter, UK students present a project called "Paint By COLI". The team attempt to modify E.coli bacteria with light sensitive and pigment production genes, in order to produce a full color biocamera. Bio-Photography is the application of genetically engineered bacteria to act as the light sensor of a camera, replacing digital sensors or photographic film. The surface area of bacteria is on the order of microns, so the resolution should be quite competitive with the current cameras. Individual bacteria functions would be geared for certain wavelengths — red light would stimulate production of cyan pigment, green light for magenta pigment and blue light for yellow.

The project is currently supported by The University of Exeter Annual Fund, CLES, CEMPS and academics from across the University. The group is going to present the project at the Genetically Engineered Machines (iGEM) event in Lyon, France on Oct. 11-13.

Crosstalk Reduction Between Multiple Structured Light Cameras

Microsoft Research posted its paper from CHI'12 conference "Shake’n’Sense: Reducing Interference for Overlapping Structured Light Depth Cameras" by Alex Butler, Shahram Izadi, Otmar Hilliges, David Molyneaux, Steve Hodges, and David Kim.

"The key behind Shake‟n‟Sense is to minimally vibrate a Kinect camera unit using an offset-weight vibration motor and thereby artificially introduce motion blur. Both the structured light DOE illuminator and the IR camera of the Kinect will move in harmony, which means that depth sensing works as normal, albeit with a little induced blur. However, even minor almost imperceptible motion of the sensor in this way causes blurring of structured light patterns from other units which serves to eliminate most of the crosstalk."

Update: It looks like University of North Carolina researchers proposed the same technique at about the same time.

Oppo is First to Use Tessera's MEMS AF

Business Wire: Tessera's DigitalOptics Corporation (DOC) announces today that Guangdong Oppo Mobile Telecommunications Corp. has placed the first mems|cam volume production purchase order. "We are proud to announce that OPPO and DOC are exclusive launch partners. OPPO will be the first smartphone OEM to incorporate mems|cam products in volume," stated John Thode, president of DigitalOptics Corporation. "OPPO has an excellent premium brand in China as demonstrated by the September 23 launch of the innovative N1 Smartphone platform. Integrating mems|cam modules into OPPO’s best-in-class smartphones will bring an exciting computational imaging user experience that further delivers on OPPO’s brand promise."

There has been speculation on who would be the first to bring the significant benefits of mems|cam to the mobile imaging market. Last week, several technology news blogs reported that mems|cam was first being brought to market in another smartphone platform (Google Nexus 5). Those reports were inaccurate.

Forbes quotes China Morning Post publishing that Oppo's total production is expected to be about 15M phones this year.

European IR Sensor Industry Consolidates

Less than a year ago France-based Sofradir acquired Quantum Well-Infrared Photodetector (QWIP) and InGaAs sensor vendors. Now Sofradir and Onera announce an agreement to transfer Onera’s thermal imaging research group to Sofradir, together with a five-year project aimed at developing disruptive technologies in infrared detection in order to provide OEMs with more highly advanced capabilities in thermal imaging.

"Sofradir and Onera are collaborating once again to break down the technological barriers in infrared by exploring new possibilities in optical integration and other techniques," said Philippe Bensussan, chairman and CEO of Sofradir. "Onera is known for its vision, vast knowledge and expertise in aerospace and defense system design. We are excited about leading future developments in IR detection. We have high expectations about what these advantages will bring to our customers who design optronics systems for defense, space and commercial applications."

The project involves transferring emerging technologies and know-how from Onera, making them ready for industrial processing. The team will carry out research on and develop new techniques for infrared detectors, such as integrated optics, greater compactness, improved functionality and performance of thermal imaging equipment.

Silicon File and Dual Aperture to Cooperate on 3D Gesture Tracking Sensor

PRNewswire: Silicon File announces its collaboration with Dual Aperture, Inc., a Silicon Valley startup, to build a new type of CMOS image sensor that can take sharp pictures, significantly reduce noise, and capture real-time distance information. Furthermore, all of this is possible while utilizing a single, low-power, small form factor sensor instead of stereoscopic sensors, a common feature of most 3D cameras in the marketplace today.

Dual Aperture's image sensor technology relies on 4-color sensor design. The 4-color sensor is comprised of RGB and IR pixels, instead of the traditional Bayer pattern. The sensor uses two separate apertures, one for the RGB spectrum and the other for the IR spectrum, to simultaneously capture two distinct images with different sharpness levels.

Silicon File Technologies will incorporate Dual Aperture's 4-color sensor technology, related image processing algorithms, and various application software into their sensors and sensor module products. These technologies will enable the following features:

• Reconstruction of color imaging from a 4-color pattern sensor
• Noise reduction and image sharpening
• Accurate depth estimation of objects captured in real-time
• Real-time touch refocusing of pictures
• Real-time 3D image pair generation
• Accurate gesture tracking using a low-power, single sensor

"Dual Aperture's technology will enable new dimensions in photography with a multi-purpose camera that uses a low cost, low power, single CMOS image sensor," says Do Young Lee, CEO of Silicon File. "We are thrilled to be the first to partner with Dual Aperture in the growing market that Dual Aperture's 4-color sensor technology has created."
David D. Lee, CEO of Dual Aperture also adds that "Dual Aperture is looking forward to working closely with Silicon File Technologies to develop commercial products targeted for various platforms based on our new ideas and Silicon Files' strong design capabilities. Because of its small form factor and low power usage, Dual Aperture's 4-color sensor technology can be used in a variety of consumer devices, including smart phones, tablets, PCs, TVs and automobile applications."

Under the agreement, Silicon File and DA will work closely together to equip other camera OEMs with new multifunctional cameras. Silicon File will also manufacture and market 4-color sensors and camera modules integrated with new features enabled by DA algorithms.

Dual Aperture apparently does not have a web site. So far USPTO published two Dual Aperture's patent applications, while WIPO lists 7 applications filed in different countries.

Application US20130033579 named "Processing Multi-Aperture Image Data" shows details of the company's technology. The 3D depth imaging part of it is explained below:

Workshop on CMOS Image Sensors for High Performance Applications

CNES, ASTRIUM, THALES ALENIA SPACE, SODERN are organizers of the 3rd workshop "CMOS image sensors for high performance applications" to be held in Toulouse, France on November 26-27, 2013. The preliminary program includes:

CMOS sensors for space applications:

• Nick Nelms, ESA
  An overview of ESA supported Visible and NIR CMOS Image Sensor development
• Jérôme Pratlong, e2v
  MTG FCI Visible Detector design and development.
• Weng-Lyang “Bill” Wang, CMOS Sensor Inc
  Five bands of CMOS Sensor (C468) for Formosat-5
• Michel Bréart de Boisanger, EADS Astrium
  CMOS Image Sensors optimized for GEO observation
• Fabien Malbet, IPAG
  Detector requirements for high accuracy astrometry and results of an interferometric detector calibration method

Low flux:

• Franck Robert, Photonis
  Photonis complementary Digital Solutions for Low Light Level and extreme low light Vision conditions
• Ajit Kumar Kalgi, Caeleste
  Photon imaging with monolithic CMOS SPADs
• Alice Pelamatti, ISAE
  An Analytical Model for the Estimation of the Full Well Capacity in Pinned Photodiode CMOS Image Sensors

TDI on CMOS:

• Alex Materne, CNES
  Development of Pixel architectures for TDI CMOS image sensors dedicated to High Resolution Earth Observation Satellites
• Alper Ercan, IMEC
  A TDI test imager in embedded CCD in CMOS technology
• Beat De Coi, ESPROS Photonics
  CCD/CMOS Imager System on a Chip
• Olivier Marcelot, ISAE
  Study of CCD Transport on CMOS Imaging Technology: Comparison Between SCCD and BCCD, and Ramp Effect on the CTI
• Frédéric Mayer, e2v
  Measurements and Analysis of a 13um Pitch Charge Transfer TDI Suitable for Space Applications Using a Standard CMOS Technology

ADCs:

• Philippe Ayzac,Thalès Alenia Space
  Design of MROD, a Space Qualified, 2 Channel, Video Chain Mixed-Signal ASIC for High Resolution Mission
• Daniel Dzahini, LPSC IN2P3
  TUTORIAL : SURVEY OF On-Chip ADCs FOR IMAGING APPLICATIONS

CMOS for Infra Red Applications:

• Harald Weller, SELEX-ES
  IR Sensors for space and astronomy applications at Selex-ES Ltd
• Vincent Gravot, ULIS
  A differential input stage for uncooled infrared pixels
• Wim Vereecken, XENICS
  The design of a 1.3 Megapixel InGaAs array with low noise and increased dynamic range Backside Illuminated CMOS
• Kiki Minoglou, IMEC
  Evaluation of backside passivation using laser annealing in backside illuminated image sensors
• Jérôme Pratlong, e2v
  TAOS II: Three 88-Megapixel astronomy arrays of large area, backthinned, and low-noise CMOS sensors
• Guy Meynants, CMOSIS
  Backside illuminated CMOS active pixel sensor with global shutter and 84 dB dynamic range

Radiation Hardness:

• Manuel Innocent, ON Semiconductor
  A radiation tolerant 4T pixel for space applications: layout and process optimization
• Harald Neubauer, IIS Fraunhofer
  Comparison of x-ray tolerant pixel-photodiode combinations (with and without in pixel charge-integration) for high sensitive x-ray detectors
• Valerian Lalucca, ISAE
  Single Event Effects in 4T and 5T Pinned Photodiode CMOS Image Sensors

Thanks to CV for sending me the program. Registration for the workshop is open here.

Samsung Develops 13MP Camera Module with OIS

Tech-On reports that Samsung Electro-Mechanics has developed a 13MP camera module for smartphones featuring optical image stabilization. The OIS can correct angular errors up to 1.5deg. This is said to be better than digital cameras on the market usually correcting 0.7deg (Actually, best digital cameras correct up to 2-2.5deg - ISW).

The dimensions of the module are 10.5 x 10.5 x 5.9mm, similar the company's existing camera modules for smartphones. Samsung Electro-Mechanics is sampling of the camera module and negotiating with smartphone makers. The company plans to begin volume production in 1H 2014.

Sharp Introduces iSHCCD II and iSHartina

Sharp announces a pair of CCDs with PAL and NTSC resolutions, with improved IR sensitivity. The company also registered tow trademarks "iSHCCD II" and "iSHartina". "iSHCCD II" is said to be an advanced CCD that drastically improves light efficiency by including near infrared light region in a basic structure of "iSHCCD". The "iSHartina" series is said to be a key device group of Sharp which realizes a next-generation sensing world.

Google Buys Gesture Recognition Startup

Gigaom, EETimes: Google has bought San Francisco-based gesture recognition startup Bot Square, developer of the Flutter. Flutter is an application that allows users to control media playback with simple gestures captured by their computer’s webcam. The company is said to be working on facial expression recognition to control mobile phones. There’s no word yet on financial details of the acquisition, but Flutter’s entire team of six employees, which includes four PhD’s, is said to join Google in Mountain View.

Rumor: Amazon Prepares 4-Camera Smartphone

Techcrunch reports that Amazon Lab126 is in the process of developing smartphone with a 3D eye-tracking interface, one at each corner of the device. The cameras will be used to track eye and head motions in order to move the interface around to ‘give the impression’ of 3D picture on screen. Another feature said to be planned for the device, but not yet locked for release, is an image recognition feature that lets users take a shot of any real-world object and match it to an Amazon product for purchase. The new phone release is not planned for this year.

Omnivision's Shareholder Presentation

Omnivision has published its Sept. 26, 2013 shareholder presentation with the last year's results and plans for future:

Fujifilm Announces CMOS Sensor for Endoscopy

In consumer applications this Fujufilm's announcement would sound like from 10 years ago. But medical market is different: "Fujifilm is proud to make use of the over-megapixel customised CMOS sensor. Our experience over many years in optoelectronics and electronic imaging shows the superior quality of this technology and we can expect that our customers will see the difference instantly" says Kazuhiko Takemura, Head of European Endoscope Department, Fujifilm Europe.

By adapting a CMOS image sensor, Fujifilm's 600 series endoscopes enable super-high resolution images to be produced. The leading-edge CMOS technology realizes less noise and brilliant images by converting the analog signal to digital in the tip of the scope. During transmission the digital signal is much less affected by any noise from the outside. CMOS technology also realizes 60fps progressive video.

Boyd Fowler Joins Google

Boyd Fowler's LinkedIn page shows that he's now Technical Program Manager at Google, since Sept. 2013. The page indicates that Boyd also continues his previous job at BAE Systems as Technical Director. Boyd has joined BAE through the acquisition of Fairchild Imaging where he was CTO. Boyd Fowler is one of the directors of IISS and recently was Co-Chair of IISW 2013 and the previous workshops too.

Pixpolar's Whitepaper

Pixpolar publishes a new technology page and a whitepaper discussing advantages of its MIG sensors's Non-Destructive Correlated Double Sampling NDCDS mode. One of the new capabilities of NDCDS is a possibility to choose ISO after the actual shot is taken in DSLRs:

"A great benefit of the MIG sensors is that the signal can be read-out accurately multiple times (due to Non-Destructive Correlated Double Sampling, NDCDS, ability). This means that one can provide the same image with multiple different ISO values. Thus one can either choose afterwards the best ISO setting or one can use different ISO values in different parts of the image. In the latter case the ISO value in each pixel is chosen e.g. such that the ISO is increased until the exposure value of the pixel exceeds a certain limit. This has also the unforeseen advantage that the amount of bits required in the Analog to Digital Converter (ADC) can be reduced while at the same time the Dynamic Range (DR) of the image can be improved.

If rolling shutter is utilized, which is typically the case in digital cameras, the reading of the signal multiple times with different ISO values bears the disadvantage that more skew is resulted in. However, in Digital Single Lens Reflex (DSLR) cameras mechanical shutter is typically used which means that the images are free of skew. Thus the MIG sensors offer for the DLSRs (and generally for digital cameras equipped with a mechanical shutter) a unique ability to afterwards adjust the ISO settings."

Another document on MIG sensors advantages for security applications shows the multiple NDCDS simulation results:

MIG Pixel

NIST Presents Passive THz Imager

Eureka: National Institute of Standards and Technology (NIST) have built a prototype passive THz imaging system for detecting hidden weapons and other threats at distances up to 28m away. The technology is similar to the NIST camera in the SCUBA-2 telescope in Hawaii. Both instruments detect emissions at a wavelength of 850um, a wavelength of light that passes through both clothing and the atmosphere. Both sets of sensor arrays are packaged with superconducting amplifiers to boost signal strength, using a NIST technique that makes large arrays practical. But the new imager's sensors are made of a different metal, aluminum, which superconducts at higher temperatures of 1.2 Kelvin. This allows the sensor array to be cooled by a more compact, custom refrigerator.

The NIST imager's video frame rate is currently 6fps, but NIST researchers say their system can be developed further to have four times as many sensors (for a total of 1,004), which would produce larger, near-full-body images at faster video frame rates. A short lab video demonstrating the imager will be available at NIST web site, when it opens again. Here is the older NIST presentation.

Meanwhile, the passive THz imaging seems to attract more and more attention. Other recent works include ones at Johnson C. Smith University at Charlotte, NC, and European THz imaging project commercialized by Spain-based Alfa Imaging:

Panasonic Wins Emmy Award for In-Camera Chromatic Aberration Compensation

Business Wire: Panasonic will be presented with a Technology and Engineering Emmy Award for 2013 by the National Academy of Television Arts & Sciences in recognition of the company’s development of In-Camera Electronic Compensation for Lateral Chromatic Aberrations in External Lenses. The trend to smaller imager formats and less-expensive optics had meant compromises in image performance without an alternative solution to this problem. The concept of modeling the aberrations of a lens and applying real-time electronic correction provides a very significant increase in image quality and permits lower cost-cameras and optics to create better images.

"Panasonic is honored to receive the coveted technical Emmy for its pioneering efforts in the development of Chromatic Aberration Compensation," said Michael Bergeron, Business Development Manager, Panasonic System Communications Company of North America (PSCNA). "This technology has helped us maintain high-quality imaging while making improvements in size, weight and affordability, and now combined with master-quality AVC-ULTRA recording and native 1920 x 1080 imagers, CAC has contributed to new benchmarks for HD acquisition, getting around inherent limitations of optics."

Forza Silicon to Present its BDA's FastSPICE-based Design Methodology

Business Wire: Daniel Van Blerkom, Forza Silicon CTO, and Ravi Subramanian, Berkeley Design Automation CEO, will jointly present a paper titled "An Efficient and Accurate Sign-Off Simulation Methodology for High-Performance CMOS Image Sensors" at the TSMC Open Innovation Platform Ecosystem Forum today in San Jose, CA. Forza Silicon uses the Analog FastSPICE (AFS) Platform from Berkeley Design Automation for circuit verification and sign-off validation of CMOS image sensors. The simulation methodology developed by Forza Silicon with the AFS Platform uses a hierarchy of models for the image sensor blocks. The complexity of the model is reduced at higher levels of the hierarchy, while still achieving maximum accuracy of the global interactions between blocks.

"With the ability to tailor our model complexity for a desired simulation, we gain the advantage of rapid, accurate validation while keeping simulation time and resources manageable," said Dr. Daniel Van Blerkom.