The HM01B0 ultra-low power consumption allows the sensor to be placed in a constant state of operation, enabling “always on”, contextually aware, computer vision capabilities such as feature extraction, proximity sensing, gesture recognition, object tracking and pattern identification.
The HM01B0 integrates a motion detection circuit with an interrupt output pin, and an automatic exposure and gain control loop to minimize host processor computation as well as data communication to reduce system power. The sensor utilizes an advanced 3.6µm pixel technology that offers sensitivity of below 1 lux. The sensor’s reflowable chip scale package measures less than 5mm2 and requires only three passive components to support a highly compact camera module and miniature wafer level module assembly.
“Our image sensors for notebook and smartphone applications, such as our ¼" 8MP MIPI sensor, have been among the lowest power in the industry,” stated Jordan Wu, CEO of Himax Technologies. “We believe that the HM01B0 is the lowest power CMOS image sensor in the industry with similar resolution, while offering outstanding sensor performance and high level of feature integration. We are excited to build upon our core competence to develop a new class of sensors that will support very low power computer vision to enable new applications across smartphones, tablets, AR/VR devices, IoT, and artificial intelligence for consumer, medical, and industrial markets. With this new ultra-low power sensor, Himax has been working with leading consumer electronic brand customers and major platform providers to help develop innovative features and reduce power consumption of existing cameras. We have received a good level of interest from quite a few of the industry’s leading players.”
Himax believes its HM01B0 is the best solution on the market to meet the ever-growing computer vision and power saving expectations and can be universally adopted for mobile devices, AR/VR devices, IoT, and artificial intelligence applications. The HM01B0 will be available in both monochrome and color options. The sensor can also integrate into Wafer Level Modules to be available for selected customers and partners in Q1 2016.
