AutoSens: Softkinetic Compares ToF with Other Approaches

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AutoSens 2016 kindly permitted me to post a couple of slides from Softkinetic presentation "3D depth-sensing for automotive: bringing ...

Samsung System LSI Might Split into Fabless and Foundry Businesses

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According to BusinessKorea sources, Samsung is contemplating to split its semiconductor business into a fabless and foundry divisions: ...

Nikon Applies for 2-Layer Stacked PDAF Patent

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NikonRumors quotes Egami talking about Nikon patent application with 2-layered pixel array forming a cross-type PDAF: " Nikon patent ...

Sony, ON Semi Image Sensor Innovations

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Framos publishes interviews with Framos North America VP Sebastian Dignard and ON Semi Go To Market Manager Michael DeLuca on image sensor...

Edoardo Charbon and Junichi Nakamura Elevated to IEEE Fellows

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Edoardo Charbon and Junichi Nakamura has been elevated to IEEE Fellows. Thanks to AT for the info!

More on Hitachi Lensless Camera

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Nikkei publishes an article with more details on Hitachi lens-less camera : " In general, the method that Hitachi employed for its len...

Image Sensors at ISSCC 2017

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ISSCC publishes its 2017 advance program . Sony is going to present its 3-die stacked sensor, a somewhat expected evolution of the stacking ...

Basler's First ToF Camera Enters Series Production

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Basler : After a successful conclusion of the evaluation phase and extremely positive customer feedback, Basler first ToF camera is now ente...

Movidius on IoT Vision Applications

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ARMDevices interviews Movidius VP Marketing, Gary Brown, on the company low power advantages of their vision processor in different applica...

Jaroslav Hynecek Gets 2016 EDS J.J. Ebers Award

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IEEE Electron Devices Society publishes a list of this year's awards. Jaroslav Hynecek receives 2016 EDS J.J. Ebers Award for " Fo...