Zoom for Curved Sensors

When Sony curved sensors were presented on summer 2014, there were concerns about their compatibility with zoom lens. Palo Alto, CA-based Optiz proposes a solution. The company believes that curved sensors will be the next big wave in mobile imaging:


Optiz does not say much about the principle of its approach, other than usual marketing words:

"Optiz's proprietary Zoom solution realizes Zoom function in the mobile imaging system without the drawback of conventional solutions."

"Optiz's proprietary pixel architecture technology includes pixel pattern design, photodiode structure and advanced imaging algorithms. With inventive thinking, we have re-imagined these three crucial aspects of the pixel technology and made great advancements in zooming, luminance and color accuracy. All doing so without creating additional complexity to the imaging system while enabling zoom function and reduce module size."

"Our innovative solution offers an optical interface structure that is built into the image sensor chip, thus imaging system need fewer lenses, simplifies the overall optical design and improves image quality."

"Optiz's Zoom solution offers a set of proprietary technology to enable greater sensitivity, lower module profile, superior zooming and dynamic focusing capabilities all without moving parts."

"The innovative pixel architecture provides significant advantages such as reduced cross talk between the pixels at the periphery of the sensor, substantial improvement of Quantum efficiency."

The company has been founded by Vage Oganesian, former Tessera VP R&D, and Wang Wei, CEO of WLCSP. Few pictures from the company site might give some hints on its technology:


Update: I received an email from Optiz saying:

"In regards to the comments on the blog post. We want to clarify that our curved sensor with varying size photodetector does not require physical bending/deformation of the image sensor. We took a conceptually different approach in obtaining the curved structure of image sensor during the fabrication process; So that our image sensor can remain stackable as most of the commercial BSI sensors of today."

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