Business Wire: Kunshan, China-based
HuaTian Technologies Ltd., also known as Q-Tech, is exapnding its WLP facility and purchasing SPTS (soon
to become Orbotech) Sigma fxP PVD system to deposit under bump metallization (UBM) for its 300mm Flip Chip line and interconnects for their CMOS sensor packages. The company is well known for its cost-effective image sensor wafer level packaging and its wafer level optics. The company's
milestones and
customer list are quite impressive:
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