AutoSens 2016 kindly permitted me to post a couple of slides from Softkinetic presentation "3D depth-sensing for automotive:...
Samsung System LSI Might Split into Fabless and Foundry Businesses
According to BusinessKorea sources, Samsung is contemplating to split its semiconductor business into a fabless and foundry...
Nikon Applies for 2-Layer Stacked PDAF Patent
NikonRumors quotes Egami talking about Nikon patent application with 2-layered pixel array forming a cross-type PDAF: "Nikon...
Sony, ON Semi Image Sensor Innovations
Framos publishes interviews with Framos North America VP Sebastian Dignard and ON Semi Go To Market Manager Michael DeLuca...
Edoardo Charbon and Junichi Nakamura Elevated to IEEE Fellows
Edoardo Charbon and Junichi Nakamura has been elevated to IEEE Fellows. Thanks to AT for the in...
More on Hitachi Lensless Camera
Nikkei publishes an article with more details on Hitachi lens-less camera:"In general, the method that Hitachi employed...
Image Sensors at ISSCC 2017
ISSCC publishes its 2017 advance program. Sony is going to present its 3-die stacked sensor, a somewhat expected evolution...
Basler's First ToF Camera Enters Series Production
Basler: After a successful conclusion of the evaluation phase and extremely positive customer feedback, Basler first ToF...
Movidius on IoT Vision Applications
ARMDevices interviews Movidius VP Marketing, Gary Brown, on the company low power advantages of their vision processor in...
Jaroslav Hynecek Gets 2016 EDS J.J. Ebers Award
IEEE Electron Devices Society publishes a list of this year's awards. Jaroslav Hynecek receives 2016 EDS J.J. Ebers Award...
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